Encapsulation of light-emitting elements on a display module

ABSTRACT

A display module comprises a circuit board having a front face, a plurality of light-emitting elements electrically coupled to the front face of the circuit board, a polymer encapsulating member adhered to the front face of the circuit board, the polymer encapsulating member substantially covering at least a portion of the circuit board and a portion of the plurality of light-emitting elements, the polymer encapsulating member substantially sealing the portion of the circuit board and the portion of the plurality of light-emitting elements, and an ultraviolet-radiation diminishing component in the polymer encapsulating member or on one or more of at least a portion of the circuit board or at least a portion of each of the light-emitting elements, wherein the ultraviolet-radiation diminishing component filters, blocks, or reflects more ultraviolet radiation than would be filtered, blocked, or reflected by the polymer encapsulating member without the ultraviolet-radiation diminishing component.

CLAIM OF PRIORITY

This application is a continuation of and claims the benefit of priorityunder 35 U.S.C. § 120 to U.S. application Ser. No. 15/141,525, filedApr. 28, 2016, entitled “ENCAPSULATION OF LIGHT-EMITTING ELEMENTS ON ADISPLAY MODULE,” which application is a continuation in part and claimsthe benefit of priority under 35 U.S.C. § 120 to U.S. patent applicationSer. No. 14/861,403, filed Sep. 22, 2015, entitled “ENCAPSULATION OFLIGHT-EMITTING ELEMENTS ON A DISPLAY MODULE,” which is a continuation ofand claims the benefit of priority under 35 U.S.C. § 120 to U.S.application Ser. No. 14/095,584, filed Dec. 3, 2013, entitled“ENCAPSULATION OF LIGHT-EMITTING ELEMENTS ON A DISPLAY MODULE,” whichclaims the benefit of priority under 35 U.S.C. § 119(e) to U.S.Provisional Application Ser. No. 61/735,346, filed Dec. 10, 2012,entitled “ENCAPSULATION OF LIGHT-EMITTING ELEMENTS ON A DISPLAY MODULE,”each of which is hereby incorporated by reference in its entirety.

BACKGROUND

Examples of video or image display modules incorporate an arrangement ofdifferent colored light-emitting elements, such as light-emitting diodes(LEDs), for example red-green-blue element pixel packages. The pixelpackages or other light-emitting element arrangements can be coupled toa circuit board. In some examples, the display module is exposed to thesurrounding environment, such as in video or image displays that areused outdoors, such as sporting venue video or image displays.

SUMMARY

This patent document discloses, among other things, a display module anda display formed from a plurality of display modules mounted to asupport chassis. Each display module includes a circuit board with aplurality of light-emitting elements that are mounted to a face of thecircuit board. A polymer encapsulating member is adhered to the circuitboard face. In some examples, the polymer encapsulating member isadhered to at least a portion of the circuit board face and at least aportion of one or more of the plurality of light-emitting elements. Thepolymer encapsulating member seals the portion of the face of thecircuit board and the portion of each light-emitting element to which itis adhered, for example by sealing the circuit board and electronicsmounted thereto from the surrounding environment.

This disclosure also describes a display module comprising a circuitboard having a front face, a plurality of light-emitting elementselectrically coupled to the front face of the circuit board, and apolymer encapsulating member adhered to the front face of the circuitboard. The polymer encapsulating member substantially covers at least aportion of the circuit board and a portion of the plurality oflight-emitting elements. The polymer encapsulating member substantiallyseals the portion of the circuit board and the portion of the pluralityof light-emitting elements. An ultraviolet-radiation diminishingcomponent can be incorporated into the polymer encapsulating member oron one or more of the circuit board or at least a portion of each of thelight-emitting elements, so that the ultraviolet-radiation diminishingcomponent filters, blocks, or reflects more ultraviolet radiation thanwould be filtered, blocked, or reflected by the polymer encapsulatingmember without the ultraviolet-radiation diminishing component

This disclosure also describes a display module comprising a circuitboard having a front face, a plurality of light-emitting elementselectrically coupled to the front face of the circuit board, and apolymer encapsulating member adhered to the front face of the circuitboard. The polymer encapsulating member substantially covers at least aportion of the circuit board and a portion of the plurality oflight-emitting elements. The polymer encapsulating member is shaped overeach of the plurality of light-emitting elements to form a lens overeach of the plurality of light-emitting elements.

This disclosure also describes a method for manufacturing a displaymodule. The method comprises providing or receiving a circuit boardcomprising a plurality of light-emitting elements to a face of thecircuit board, forming a polymer encapsulating member over at least aportion of the face of the circuit board and at least a portion of eachof the plurality of light-emitting elements, adhering the polymerencapsulating member to the face of the circuit board, and sealing atleast the portion of the face of the circuit board and the portion ofeach of the plurality of light-emitting elements with the polymerencapsulating member

These and other examples and features of the present display modules andrelated methods will be set forth, in part, in the following DetailedDescription. This Summary is intended to provide an overview of subjectmatter of the present disclosure—it is not intended to provide anexclusive or exhaustive explanation. The Detailed Description below isincluded to provide further information about the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like numerals can be used to describe similar elementsthroughout the several views. Like numerals having different lettersuffixes can be used to represent different views of similar elements.The drawings illustrate generally, by way of example, but not by way oflimitation, various examples discussed in the present document.

FIG. 1 is a perspective view of an example display module.

FIG. 2 is an exploded side view of an example display module.

FIG. 3 is a cross-sectional side view of an example of an assembleddisplay module.

FIG. 4 is a perspective view of several light-emitting display elementsmounted to a circuit board that has been encapsulated with anencapsulation mask.

FIG. 5 is an exploded rear perspective view of an example displaymodule.

FIG. 6 is a cross-sectional side view of an example display moduleshowing an altered viewing angle due to the use of an encapsulation maskand a lens.

FIG. 7 is a cross sectional view of a circuit board in a mold forforming an encapsulation mask around the circuit board with anencapsulating material.

FIG. 8 is a flow chart of an example method of manufacturing a displaymodule.

FIG. 9 is a cross sectional view of another example display module thatincludes a radiation filtering or blocking coating.

FIG. 10 is a cross sectional view of an example display module with asurface-mount light-emitting element electrically mounted to a circuitboard.

DETAILED DESCRIPTION

In the following Detailed Description, reference is made to theaccompanying drawings which form a part hereof The drawings show, by wayof illustration, specific examples in which the present display modulesand related methods can be practiced. These examples are described insufficient detail to enable those skilled in the art to practice, and itis to be understood that other embodiments can be utilized and thatstructural changes can be made without departing from the scope of thepresent disclosure. Therefore, the following Detailed Description is notto be taken in a limiting sense, and the scope of the present disclosureis defined by the appended claims and their equivalents.

FIG. 1 shows a perspective view of a non-limiting example of a displaymodule 10. In some examples, the display module 10 is configured todisplay one or more of video, graphical, or textual information. Forthis reasons, the display module 10 will be described hereinafter as a“video display module 10,” for the purpose of brevity. The video displaymodule 10 can be combined with a plurality of identical or similarvideo, graphical, or textual display modules, each referred to herein as“video display modules 10.” Each of the plurality of video displaymodules 10 can be mounted to a support chassis and operated together asa single display. The display can appear as a single display when viewedby a user. Each video display module 10 can include a front displaysurface 12 that can be configured to provide for a display one or moreof graphics, video, or textual content. The front display surface 12 canbe formed from a plurality of individual light-emitting elements 14. Inan example, the light-emitting elements 14 can comprise light-emittingdiode (LED) devices, although other types of light-emitting devices canbe used. For the sake of brevity, the remainder of this disclosure willdescribe the light-emitting elements 14 as LEDs 14. The remainder ofthis disclosure will also describe the video display module 10 as an LEDmodule 10 and will describe the display that can be formed from aplurality of the LED modules 10 as an LED display. However, a person ofskill in the art will understand that the term “LED” or “LED display,”as used herein, can include any type of practical light-emitting device,including, but not limited to, light-emitting diodes (LEDs), organiclight-emitting diodes (OLEDs), organic light-emitting transistors(OLETs), surface-conduction electron-emitter display devices (SEDs),field-emission display devices (FEDs), laser TV quantum dot liquidcrystal display devices, quantum dot display devices (QD-LED),ferro-liquid display devices (FLDs), liquid crystal display devices(LCDs), and thick-film dielectric electroluminescent devices (TDELs), orany other form of light-emitting technology that is or can be used forthe display of video, graphical, or textual information.

When multiple LEDs 14 are positioned together in close proximity,various colors can be shown by combining the colors of one or more ofthe LEDs 14. In an example, the front display surface 12 can include anarray of LED pixels, with each LED pixel including a combination ofthree or more different colored LEDs, such as a pixal comprising a redLED, a green LED, and a blue LED. The red, green, and blue LEDs of eachpixel can cooperate to provide a spectrum of colors when one, two, orthree of the light emitting elements in a pixel are lit at varyingintensities. The front display surface 12 can also provide a black orempty looking surface over a portion of the display, when desired, bydeactivating or turning off the LEDs in a particular portion of thefront display surface 12. The front display surface 12 of the LED module10 can be combined with front display surfaces of one or moreadjacently-positioned LED modules to form a front display surface of alarger LED display.

FIG. 2 shows an exploded side view of the LED module 10. FIG. 3 shows across-sectional side view of a portion of the LED module 10. The LEDmodule 10 can include a circuit board 16 and a plurality of LEDs 14. Theplurality of LEDs 14 can be mounted and electrically coupled to a frontface 18 of the circuit board 16. In an example, the LEDs 14 can comprisesurface-mount technology (SMT) LEDs, also referred to as surface-mountLEDs. Surface-mount technology is in contrast to through-holetechnology, wherein an LED includes a lead pin that can be insertedthrough a hole in the circuit board, wherein the lead pin can besoldered to a connection pad on the back side of the circuit board. Asurface-mount LED can be mounted directed onto the front face of acircuit board by being soldered directly to solder pads. Surface-mountLEDs can be smaller than through-hole LEDs and can take up less space onthe circuit board. Surface-mount LEDs can therefore achieve higherresolution than through-hole LEDs.

Surface-mount LEDs 14 can result in difficulties with sealing the LEDs14 and other components of the module 10. For example, becausesurface-mount LEDs are often low profile, with little distance betweenthe surface of the circuit board and the outer face of the LED, it isoften necessary to seal over the top of the entire LED. For this reason,the sealing structure or material must be configured so as to notoptically interfere with LEDs. In addition, because surface-mount LEDsare soldered to a front surface of the circuit board, the solder can beexposed to ultraviolet (UV) radiation in outdoor video display modules.Many solder materials are UV-sensitive and can break down over time whenexposed to UV radiation. An encapsulating mask 20 (which can also bereferred to as an encapsulation member) can be formed over at least thefront face 18. As described in more detail below, the encapsulating mask20 can substantially cover and substantially seal at least a portion ofthe front face 18 and at least a portion of the LEDs 14 mounted to thefront face 18. In an example, best seen in FIG. 2, the encapsulatingmask 20 can include a plurality of projections 21 that are eachconfigured to receive and cover a corresponding LED 14. The materialthat forms the encapsulating mask 20 can be substantially transparent sothat light emitted from the LEDs 14 can be emitted through theencapsulating mask 20. In an example, the projections 21 can beconfigured to form a lens that can alter the light emitted by anunderlying LED 14. As described in more detail below, the lensing effectof each projection 21 can be configured to provide for an alteredviewing angle of the LED 14 compared to the viewing angle that would beexperienced without the encapsulating mask 20.

The encapsulated circuit board 16 can be coupled to a housing 22. TheLED module 10 can be configured for use in an exterior environment, suchas a scoreboard or marquee for an outdoor stadium, arena, or otheroutdoor venue, or in an interior environment, such as an indoor stadium,arena, or other indoor venue.

A louver 24 can be mounted over the encapsulated front face 18 of thecircuit board 16. The louver 24 can include a plurality of openings thatcan receive the plurality of LEDs 14 so that one or both of the LEDs 14and the projections 21 protrude at least partially into the LEDopenings. In an example, each LED opening can be sized and shaped toreceive a corresponding LED 14 and a projection 21 of the encapsulationmask 20. The LED openings in the louver 24 can be in a specified patternand posture corresponding to the location of the LEDs 14 mounted to thecircuit board 16. In an example, the circuit board 16 can be alignedwith the louver 24 and each LED opening can be registered with acorresponding LED 14. In an example, the louver 24 includes a pluralityof louver blades 28. The louver blades 28 can extend at least partiallyover or under the one or more of the LEDs 14 projecting through the LEDopenings louver 24. Each louver blade 28 can provide a measure of shadeto one or more corresponding LEDs 14 and can thus assist in preventinginteraction of the LED 14 with sunlight. For instance, glare, such assunlight glare off of the LEDs 14, can interfere with projection of atrue color from the LED module 10. Accurate representation of graphicand video content can be frustrated by this interference. The shadeprovided by the louver blades 28 can assist in preventing glare from theLEDs 14 and additionally can allow the LEDs 14 to present a true coloror a near true color from a shaded field with minimized interaction withambient light. Further, the louver blades 28 can provide shadow in anarea of the front display surface 12. When it is desired that a portionof the front display surface 12 be dark or present a black surface whenvideo or graphic content is displayed, the shade provided by the louverblades 28 can assist so that the unlit portion of the front displaysurface 12 can appear black. If glare, such as sunshine glare, is notexpected to be an issue, such as when the LED module 10 is configuredfor use in an interior environment or if the module 10 will be shaded byanother structure during use, then the louver blades 28 can be omitted.

FIGS. 2 and 3 show an example of a video display module 10 including acircuit board 16 encapsulated by an encapsulating mask 20. As shown inFIGS. 2 and 3, the encapsulating mask 20 can substantially cover atleast the front face 18 of the circuit board 16 and the LEDs 14 mountedto the circuit board 16. In an example, the encapsulating mask 20 canencapsulate all or substantially all of the circuit board front face 18and can encapsulate all or substantially all of the LEDs 14 mounted tothe circuit board 16. In the example shown in FIG. 2, the encapsulatingmask 20 can encapsulate all or substantially all of the circuit board16, e.g., all or substantially all of the front face 18, all orsubstantially all of an opposing rear face 30 of the circuit board 16,and all or substantially all of the edges 32 of the circuit board 16.

The encapsulating mask 20 can be adhered to all or substantially all ofthe surfaces that the mask 20 is intended to be sealing. In an example,the encapsulating mask 20 can be formed over the top of the circuitboard 16 and mounted LEDs 14, such as by casting or molding the materialof the encapsulating mask 20 around or over the circuit board 16, asdescribed in more detail below. Casting or molding of the encapsulatingmask 20 can provide for adhesion of the material to substantially theentirety of the front face 18 of the circuit board 16, and if desiredsubstantially the entirety of the rear face 30 as well, to provide forsealing of substantially all of the surfaces that are covered by theencapsulating mask 20.

In an example, described in more detail below, the encapsulating mask 20is formed by molding a seal material onto or around the circuit board16. The circuit board 16 can be placed in a mold with a mold cavityhaving a shape that corresponds to a desired shape of the encapsulatingmask 20. The mold can be configured so that the resulting encapsulatingmask 20 has a profile that substantially corresponds to or matches aprofile of the circuit board 16.

The material of the encapsulation mask 20 can be any material that issuitable for sealing the LEDs 14 and other electronic components mountedto the circuit board 16 from the environment, and particularly from airand moisture. The material of the encapsulation mask 20 can be selectedbased on at least one of the following characteristics:

-   -   (a) the ability of the material to be molded into the desired        final shape of the encapsulation mask 20—moldability of the        encapsulating material can include how rapidly the material can        be molded (with faster molding being preferred), and how easily        the material can be dispensed into the mold geometries that form        the encapsulating mask 20. The ability to shape the        encapsulation mask 20 can also include the tolerance that can be        achieved around the LED 14 and the encapsulation mask 20, such        as between the projections 21 and the louver 24, as shown, for        example, in FIG. 2. A larger tolerance, while still providing        for the same pixel pitch, is desirable because it can provide        for easier large-scale manufacturing;    -   (b) the optical properties of the final encapsulation mask 20,        including transparency to the light emitted from the LEDs 14,        and the percentage of light emitted by an LED 14 that is        actually transmitted through the encapsulation mask 20 (e.g.,        the portion of the light that is not reflected back by the        encapsulation mask 20 or absorbed by the encapsulation mask 20);    -   (c) the temperature stability of the material—in an outdoor        video display module 10, the material of the encapsulating mask        20 can be subjected to a wide range of temperatures over a        normal annual cycle. In an example, it can be preferred that the        encapsulating material be stable at low temperatures down to        −40° C., or lower and at high temperatures of up to 85° C. or        higher;    -   (d) the ability to dispense the material without the presence of        gas bubbles or to remove the gas bubbles before curing—because        the encapsulating mask 20 can cover the LEDs 14, it would be        undesirable for the encapsulating mask 20 to include embedded or        entrained air bubbles. If an air bubble were to be placed over        an LED 14, then the air bubble could interfere with the optics        of the LED 14 and create a distorting effect in the video image        or video of the video display module 10;    -   (e) aspects of the curing of the material, including method of        curing, speed of curing, and changes that occur with the        material during curing (e.g., expansion or contract and shape        change);    -   (f) the ability for the encapsulating mask 20 to seal against        water, such as the ability to hermetically seal the LEDs 14 and        other components mounted to the circuit board 16;    -   (g) corrosion resistance for the components sealed by the        encapsulation mask 20;    -   (h) the coefficient of thermal expansion for the material in for        the temperatures that are expected to be encountered by the        video display module 10—as noted above, outdoor video display        modules can experience a wide range of temperatures over an        annual cycle (e.g., from −40° C. to 85° C.), such that the        encapsulating mask 20 can experience repeated cycles of        expansion and contraction. Such expansion and contraction can        put stress on the encapsulating mask 20 itself, on the LEDs 14        and other components of the circuit board 16, and on the        adhesive connection between the encapsulating mask 20 and the        LEDs 14 or the circuit board 16. Preferably, the coefficient of        thermal expansion over the expected ambient temperatures is such        that they do not cause damage to the circuit board 16, the LEDs        14, or the encapsulating mask 20 and does not become separated        from the LEDs 14 or the circuit board 16.    -   (i) the durability of the material—in particular, the durability        of the encapsulating mask 20 with respect to abrasion (e.g., via        dust and other debris that can be blown into the video display        module 10 by winds), the durability of the encapsulating mask 20        with respect to chemicals that are expected to be encountered by        the video display module 10 (e.g., environmental chemicals or        pollutants such as salt spray in coastal areas), the        encapsulating mask 20 resistance to fire or flame, and        resistance to UV radiation, such as resistance of the        encapsulating mask 20 to UV;    -   (j) material reparability—the encapsulating mask 20 can become        damaged during manufacturing, transportation, installation,        repair, or over time while the video display module 10 is        installed. However, it can be undesirable to require replacement        of the entire video display module 10 if small damage or a small        defect in the encapsulating mask 20 is discovered. Therefore, if        the encapsulating mask 20 can be repaired, such as by filling a        defect or painting over the defect with the same or a different        encapsulating material, it would be desirable. In particular,        the ability to repair a defect in the field without having to        ship the video display module 10 back to the original        manufacturer or another repair facility would be very desirable;    -   (k) material cost;    -   (l) the ability of the material to filter out undesirable        frequencies of the electromagnetic spectrum. For example, the        material of the encapsulating mask 20 can be selected or        modified so that it will filter out or block potentially        damaging radiation, such as wavelengths of light corresponding        to ultraviolet (UV) light. Therefore, in some examples, the        encapsulating mask 20 protects components enveloped or covered        by the encapsulating mask 20 from degradation due to exposure to        the damaging radiation, such as the breakdown of solder        materials from exposure to UV light. In addition to the        filtering of undesired frequencies (e.g., UV light wavelengths),        the material of the encapsulating mask 20 can be selected or        modified to allow desired frequencies of the electromagnetic        spectrum to pass through the encapsulating mask 20. For example,        the material of the encapsulating mask 20 can be selected or        modified to filter or block undesired frequencies (e.g., UV        light) and to allow visible light, or at least a substantial        portion of visible light wavelengths, to pass through the        encapsulation mask 20 so that the visible light being emitted by        the LEDs 14 will pass through the encapsulating mask 20 and be        visible without substantial distortion. In an example, a base        material of the encapsulating mask 20 may be unable, by itself,        to filter or block undesired frequencies, but may be        supplemented with additives, as described in more detail below,        that will modify the encapsulating mask 20 and cause it to        filter out or block the undesired frequencies, for example by        filtering, blocking, or reflecting wavelengths in the        ultraviolet spectrum, such as UV light.

The encapsulation mask 20 can be formed from one or more base materials.As used herein when referring to the encapsulation mask 20, the term“base material” can refer to a material or materials that makes up asubstantial portion of the weight fraction of the encapsulation mask.The term “base material” can also refer to any material that is presentin sufficient quantities that it can form a noticeable and substantialportion of the physical structure of the encapsulation mask 20. In thisway, a “base material” can be contrasted with additives, such asdescribed in more detail below, which can alter properties of the basematerial, but which are not selected to provide a substantial portion ofthe physical form of the encapsulation mask 20. Examples of basematerials that can be used for the encapsulation mask 20 include, butare not limited to, nylons, polycarbonates, silicones and polyurethanes.In an example, the encapsulation mask 20 can be molded from a basematerial that is a silicone encapsulant, such as silicone electronicsencapsulants manufactured by Dow Corning Corp., Midland, Mich., USA,such as Dow Corning EE-1184 silicone encapsulant.

In an example, the term “base material,” when referring to theencapsulation mask 20, can refer to one or more materials that make up amajority of the weight fraction, e.g., more than 50 wt %, of theencapsulation mask 20, and in most examples that make up substantiallymore than 50 wt % of the encapsulation mask, such as at least 60, atleast 70, at least 75, at least 80, at least 81, at least 82, at least83, at least 84, at least 85, at least 86, at least 87, at least 88, atleast 89, at least 90, at least 91, at least 92, at least 93, at least94, at least 95, at least 96, at least 97, at least 98, or at least 99wt. % of the encapsulation mask. In some examples, there can be only asingle composition that would be considered a “base material,” such asjust a silicone or just a polyurethane.

In some examples, there is only a single composition that is a “basematerial” of the encapsulating mask 20, such as just a silicone basematerial or just a polyurethane base material. In such a case, then thesingle base material would, by itself, make up at least 50 wt % of theencapsulation mask 20 (or any of the other wt % thresholds describedabove). In other examples, the “base material” of the encapsulation mask20 includes a blend of two or more materials where each material of theblend may be selected to provide certain characteristics or propertiesto the encapsulation mask 20. In such a case, each material of the basematerial blend may, individually, not make up a majority of the weightfraction of the encapsulation mask 20, but each individual component ofthe blend may make up a substantial portion of the structure of theencapsulation mask 20.

The material of the encapsulation mask 20 can include one or moreadditives, such as additives that can modify or supplement theproperties of the base material of the encapsulation mask 20. As usedherein when referring to the material of the encapsulation mask 20,“additive” can refer to a substance that is added to the base materialin order to modify, supplement, or enhance the properties of the basematerial. In an example, an additive provides a functionality for theencapsulation mask 20 that would not occur due to the base materialwithout the presence of the additive. An additive can be one or morecompounds or materials that are mixed or blended with the base material,but that do not chemically modify the chemical structure of the basematerial. An additive can be one or more chemical modifications to thechemical structure of the base material, such as a chemical branchingagent, a copolymer block, or a compound that is crosslinked or otherwisechemically bonded to the chemical structure of the base material.

Energy can be transferred from an emitting source to a receiving body,such as through the emission of radiation in the electromagneticspectrum. The electromagnetic spectrum is separated into different typesof radiation, which are typically defined by the wavelength of theemitted radiation. In an example, the electromagnetic spectrum isseparated into a visible frequency range, such as is defined byelectromagnetic radiation with wavelengths from about 700 nanometers (ornm) to about 400 nm (428-749 terahertz or THz), an ultraviolet (or UV)frequency range, such as is defined by electromagnetic radiation withwavelengths from about 400 nm to about 10 nm (749 THz to 30 petahertz orPHz), and an X-ray frequency range, such as defined by electromagneticradiation with wavelengths less than about 10 nm (30 PHz).

Energy transmission from an emitting source to a receiving body can beinterrupted (e.g., substantially or completely prevented) with the useof a component that filters, blocks, or reflects the radiation. In someexamples, a display module, such as the display module 10, includes anultraviolet-radiation (UV) diminishing component that filters, blocks,or reflects UV from being emitted onto UV-sensitive structures in thedisplay module, including, but not limited to, one or more of: portionsof the circuit board 16, the LEDs 14 or a portion of the LEDs 14, one ormore electronic components mounted to the circuit board 16 (such as theelectronic components 256 of the display module 210 described below withrespect of FIG. 10), or a solder for electrically coupling the LEDs orthe electronic components to the circuit board 16 (e.g., the solder 260described below with respect to FIG. 10). In an example, the UVdiminishing component filters, blocks, or reflects more UV radiationthan would be filtered, blocked, or reflected by the encapsulation mask20 by itself (e.g., than the encapsulation mask 20 made only from thebase material). In some examples, the UV diminishing component filters,reflects, or blocks sufficient UV radiation such that the UV-sensitivestructures and components of the display module 10 can have an expectedlife that is substantially longer than could be achieved without usingthe UV diminishing component, e.g., for a specified life under normal,year-round outdoor exposure of at least about ten years, for example atleast about seven years In some examples, the UV diminishing componentincludes one or both of: (a) an additive to the material that forms theencapsulation mask 20, such as an additive combined with a base materialand configured to form an encapsulation mask 20; and (b) a coating, suchas a blocking coating configured to protect a surface that can degradewith exposure to electromagnetic radiation.

In an example, an additive is added to the base material to form theencapsulation mask 20 that filters out or blocks frequencies of theelectromagnetic spectrum. In some examples, the additive includes one ormore UV-filtering or UV-blocking additives that, in combination with thebase material, allows the encapsulation mask 20 to filter, block, orotherwise limit ultraviolet frequencies, such as UV light, from passingthrough the encapsulation mask 20 and irradiating the circuit board andelectronics on the circuit board. As used herein, the term “filter,”when referring to preventing the transmission of certain wavelengths oflight, and in particular UV light, through the encapsulation mask 20,can refer to the material of the encapsulation mask 20 only allowingtransmission therethrough of a specified wavelength or range ofwavelengths at or below a specified transmission percentage threshold.In an example, the transmission percentage threshold is 10% or less,meaning that the encapsulation mask 20 is configured so that no morethan 10% of the specified wavelengths of light (e.g., UV light) will betransmitted through the encapsulation mask 20. In some examples, thetransmission percentage threshold is specified to be less than 10%, suchas 9.5% or less, 9% or less, 8.5% or less, 8% or less, 7.5% or less, 7%or less, 6.5% or less, 6% or less, 5.5% or less, 5% or less, 4.9% orless, 4.8% or less, 4.7% or less, 4.6% or less, 4.5% or less, 4.4% orless, 4.3% or less, 4.2% or less, 4.1% or less, 4% or less, 3.9% orless, 3.8% or less, 3.7% or less, 3.6% or less, 3.5% or less, 3.4% orless, 3.3% or less, 3.2% or less, 3.1% or less, 3% or less, 2.9% orless, 2.8% or less, 2.7% or less, 2.6% or less, 2.5% or less, 2.4% orless, 2.3% or less, 2.2% or less, 2.1% or less, 2% or less, 1.9% orless, 1.8% or less, 1.7% or less, 1.6% or less, 1.5% or less, 1.4% orless, 1.3% or less, 1.2% or less, 1.1% or less, or 1% or less. In anexample, a UV-filtering or blocking additive is an ultraviolet absorber,for example by including a type of light stabilizer, that can functionto absorb UV radiation, such as by competing with chromophores to absorbUV radiation. In some examples, ultraviolet absorbers convert harmful UVradiation into harmless infrared radiation or heat, which is dissipatedthrough the polymer matrix. In an example, ultraviolet absorbers includecompounds such as hydroxybenzophenone and hydroxyphenylbenzotriazole.

Specific compounds can be added to the base material of theencapsulation mask to provide for UV-filtering or UV-blocking. In anexample, where the base material comprises a nylon, the UV-filtering orUV-blocking additive includes oxanilides. In an example, where the basematerial comprises a polycarbonate, the UV-filtering additive includesbenzotriazoles.

In an example, a UV-filtering or UV-blocking additive is from about 0.01to about 15 weight % of the encapsulating mask 20, such as from about 2weight % to about 6 weight %, for example from about 4 weight % to about5 weight % of the encapsulating mask 20. In some examples, theUV-filtering additive is less than 15% weight % of the encapsulatingmask 20, such as 14.5% or less, 14% or less, 13.5% or less, 13% or less,12.5% or less, 12% or less, 11.5% or less, 11% or less, 10.5% or less,10% or less, 9.5% or less, 9% or less, 8.5% or less, 8% or less, 7.5% orless, 7% or less, 6.5% or less, 6% or less, 5.9% or less, 5.8% or less,5.7% or less, 5.6% or less, 5.5% or less, 5.4% or less, 5.3% or less,5.2% or less, 5.1% or less, 5.0% or less, 4.9% or less, 4.8% or less,4.7% or less, 4.6% or less, 4.5% or less, 4.4% or less, 4.3% or less,4.2% or less, 4.1% or less, 4% or less, 3.9% or less, 3.8% or less, 3.7%or less, 3.6% or less, 3.5% or less, 3.4% or less, 3.3% or less, 3.2% orless, 3.1% or less, 3% or less, 2.9% or less, 2.8% or less, 2.7% orless, 2.6% or less, 2.5% or less, 2.4% or less, 2.3% or less, 2.2% orless, 2.1% or less, 2% or less, 1.9% or less, 1.8% or less, 1.7% orless, 1.6% or less, 1.5% or less, 1.4% or less, 1.3% or less, 1.2% orless, 1.1% or less, or 1% or less of the encapsulating mask 20.

In an example, for a base material including a silicone polymer, such aspolydimethylsiloxane (PDMS), the UV-filtering or UV-blocking additiveincludes at least one of benzophenone, benzotriazole, and octylmethoxycinnamate.

In some examples, the addition of an additive, such as a UV-filtering orUV-blocking additive, to the base material of the encapsulation mask 20may not be feasible or desirable. Therefore, in some examples, at leasta portion of components of the video display module 10 is protected fromundesirable frequencies of the electromagnetic spectrum, such as UVlight, with a coating, such as a UV-filtering or UV-blocking coating. AUV-filtering or UV-blocking coating can be used in place of or inaddition to UV-filtering or UV-blocking additives in the encapsulationmask 20, for example as described above. For example, there may beinstances where a UV-filtering or UV-blocking additive provides adequatefiltering or blocking of certain wavelengths of undesired UV light, butmay not provide sufficient filtering of other wavelengths. In someexamples, a UV-filtering or UV-blocking additive may lose effectivenessafter a certain period of time. In such cases, the use of a UV-filteringor UV-blocking coating in addition to one or more UV-filtering orUV-blocking additives in the encapsulating mask 20 can be used.

In an example, a filtering or blocking coating includes one or morematerials configured to substantially or completely prevent undesiredelectromagnetic radiation, such as UV radiation, from irradiatingsurfaces covered with the filtering or blocking coating. In this way,the filtering or blocking coating provides protection for components orsurfaces that can degrade with exposure to the undesired electromagneticradiation. For example, a UV-filtering or UV-blocking coating can beapplied to the circuit board of a display module and any electronicsmounted to the circuit board that are susceptible to damage when exposedto UV radiation.

FIG. 9 is a cross sectional view of another example display module thatincludes a radiation filtering or blocking coating. In an example, themodule 210 includes a circuit board 216 with a plurality of LEDs 214(only one LED shown in FIG. 9). A radiation filtering or blockingcoating 254 is applied to the circuit board 216. In an example, theradiation filtering or blocking coating 254 is applied as a thin layerof material to completely or substantially completely cover one or moresurfaces of the circuit board 216 that may be susceptible to UV damagesuch that the coating 254 is a UV-filtering or UV-blocking coating 254.In an example, the radiation filtering or blocking coating 254 isapplied to one or more of a front surface 218, a rear surface 230, or anedge 232 of the circuit board 216. In the example shown in FIG. 9, thecoating 254 is applied to the front surface 218, the edge 232, and atleast a portion of the rear surface 230. In another example, shown inFIG. 10, the coating 254 is applied to the front surface 218 of thecircuit board 216, and not to the edge 232 or the rear surface 230. Inan example, the radiation filtering or blocking coating 254 is appliedover at least a portion of one or more electronic components 256 mountedto the front surface 218 of the circuit board 216. In an example, theradiation filtering or blocking coating 254 provides protection for boththe front surface 218 of the circuit board 216 and at least a portion ofeach of the electronic components 256 that are coated.

In an example, the radiation filtering or blocking coating 254 isapplied so that the LEDs 214 are readily mountable to the circuit board216. In an example where the LEDs 214 are surface mount LEDs 214, theradiation filtering or blocking coating 254 is applied before surfacemounting the LEDs 214 by applying the coating 254 to the circuit board216 so that contact pads 258 onto which the surface mount LEDs 214 willbe mounted are left exposed, as shown in the example of FIG. 9, e.g., sothe contact pads 258 are at least partially uncoated by the radiationfiltering or blocking coating 254. In an alternative example, thesurface mount LEDs 214 are mounted to the circuit board 216 beforeapplying the radiation filtering or blocking coating 254 so that thecoating 254 does not overly cover the contact pads 258.

FIG. 10 is a cross sectional view of an example display module 210 witha surface-mount LED 214 mounted to the circuit board 216. The surfacemount LED 214 is electrically connected to the circuit board 216, suchas with solder 260. In an example, the radiation filtering or blockingcoating 254 is applied to one or more surfaces of the circuit board 216to which surface mount LEDs 214 have been electrically connected toprotect the circuit board 216 or the solder 260, or both. In an example,the one or more surfaces onto which the coating 254 is applied includesat least one of: one or more surfaces of the circuit board 216 notoccupied by the surface mount LEDs 214; one or more surfaces of thesolder 260; or at least a portion of one or more surfaces of the LEDs214 that will not prevent emission of visible light from the LEDs 214 inthe form of visual information viewable by an intended audience, such asat least a portion of one or more side surfaces of the LEDs 214, e.g.,as shown in the example of FIG. 10.

In an example, the radiation filtering or blocking coating 254 includesa material that can be easily applied to the surfaces to be protected.In an example, the radiation filtering or blocking coating 254 isapplied so that it covers all or substantially all of the surfaces thatare to be protected, such as to form a barrier on the protected surfaceor surfaces to the undesired electromagnetic radiation. In an example,the coating 254 includes materials that, at least initially, are in aliquid form, such as a paint, a mastic composition, or an epoxycomposition. In an example, the coating 254 includes materials that, atleast at some point, are in a dry form, such as a powder coat. In anexample, the coating 254 can include one or more additives, such ascarbon black (for example a carbon black pigment) or iron oxide, in aquantity sufficient to filter or block radiation, such as UV radiation.Quantities sufficient to filter or block radiation can include a rangeof one or more additives, such as additives in a range of approximately0.1% to approximately 50% by weight including a range of approximately0.5% to approximately 2% by weight. In an example, approximately 1% byweight carbon black including a carbon black pigment can be added to theblocking coating 254. In an example, approximately 1% by weight ironoxide can be added to the blocking coating 254. In an example, additivesincluding combinations of carbon black and iron oxide in variousproportions accounting for approximately 1% by weight can be added tothe blocking coating 254.

In an example, the radiation filtering or blocking coating 254 includesone or more additives. In an example, the one or more additives of thecoating 254 include one or more hydrophobic additives to shed liquidsfrom the protected surface. In an example, the one or more additives ofthe coating 254 includes one or more materials that can filter, reflect,or absorb an energy sources, such as one or more energy filtering orblocking additives that absorb, block, or reflect radiation ofundesirable frequencies, e.g., to protect at least one of the circuitboard 216, the electronic components 256, the LEDs 214, or the solder260 from the undesirable radiation. In an example, the radiationfiltering or blocking coating 254 includes one or more materials thatblock, reflect, or absorb—or substantially block, reflect orabsorb—ultraviolet radiation, such as UV light, such that the coating254 is a UV-filtering or UV-blocking coating 254. In an example, aUV-filtering or UV-blocking coating 254 includes one or more pigmentsknown to substantially block or shield UV radiation, such as a carbonblack pigment.

Returning to the module 10 shown in FIGS. 1-6, the encapsulating mask 20can also form a lens over each of the LEDs 14 to enhance or optimize theoptics for light emitted from the LEDs 14. As noted above, a lensingeffect of the encapsulating mask 20, e.g., via a lens formed by theprojection 21, can provide for an altered viewing angle of the LED 14compared to the viewing angle that would be experienced without theencapsulating mask 20, as demonstrated in FIG. 6. FIG. 6 shows a naturalviewing angle θ of the LED 14 that would occur if the encapsulating mask20 did not act as a lens for the LED 14 and an altered viewing angleθ_(Lens) that can occur if the encapsulating mask 20 is configured toact as a lens. As shown, the natural viewing angle θ can be such that alouver blade 28 will interfere with the light being emitted from the LED14 unless the length L_(Blade) of the louver blade 28 is shortened(which, in turn, can reduce the effectiveness of the louver blade 28 forits purpose of improving contrast of the display module 10). Thelens-altered viewing angle θ_(Lens) can allow for a desired lengthL_(Blade) of the louver blade 28 without interference with light fromthe LED 14.

FIG. 8 shows a flow chart of an example method 100 for manufacturing avideo display module, such as module 10, including a video-displayelement circuit board 16 at least partially encapsulated by anencapsulation mask, such as encapsulation mask 20. The method 100 caninclude, at 102, assembling a circuit board 16 for a video displaymodule 10, such as by mounting a plurality of light-emitting elements,such as LEDs 14 to a front face 18 of the circuit board 16. Assemblingthe circuit board 16, at 102, can also include mounting other electricalcomponents that can provide for operation of the video display module10, such as capacitors and convertor components (e.g., DirectCurrent-Direct Current convertors. Mounting the LEDs 14 and otherelectrical components can include soldering the LEDs 14 or components toconnection pads (e.g., solder pads) on the circuit board 16, such as byapplying a solder paste to the solder pads, placing the LEDs 14 andcomponents onto the solder paste, and reflowing the solder to form amechanical and electrical connection between the LEDs 14 and othercomponents and the solder pads. Assembling the circuit board 16, at 102,can also include electrically connecting the LEDs 14 and otherelectrical components, such as by forming the solder pads and conductionpathways, such as traces, on the circuit board 16. Alternatively, thecircuit board 16 can be manufactured by a third party, e.g., a vendor orcontractor, and received at step 102.

In an example, the encapsulating material that may be desirable for itsmechanical properties and durability properties may not form asatisfactory bond with the front face 18 or the LEDs 14. Therefore, someform of surface treatment can be used, at 104, to surface treat at leasta portion of the front face 18 or at least a portion of the plurality ofLEDs 14, or both. In an example, the surface treatment can comprisechemical treatment of the front face 18 and the LEDs 14. The chemicaltreatment can comprise treating the surfaces of the front face 18 andthe LEDs 14 that are to be covered by the encapsulating mask 20 with oneor more chemicals that can alter one or more physical or chemicalproperties of the treated surfaces. For example, the treating chemicalor chemicals can alter bonding sites on the surfaces or the treatingchemical can enhance the surface energy of the surfaces.

In an example, treating the surfaces, at 104, can comprise applying aprimer material to the surfaces of the front face 18 and the LEDs 14,wherein the primer material can sufficiently bond to the front face 18and the LEDs 14 as well as to the encapsulating material of theencapsulating mask 20.

In another example, surface treating the LEDs 14 and the circuit board16, e.g., treating the front face 18, at 104, can include at least oneof plasma treatment, flame treatment, and an ultraviolet ozone treatment(also referred to herein as “UVO treatment”), of the surfaces that areto be covered by the encapsulating mask 20. In an example, plasmatreatment includes exposing the portions of the circuit board 16 to aplasma, such as an atmospheric plasma treatment. Plasma treatment canactivate the surfaces to provide for adhesion of the material of theencapsulating mask 20 to the LEDs 14 and the circuit board 16. In anexample, plasma treatment can alter the surface energy of the surfacesof the LEDs 14 or the circuit board 16, or can alter the surface tensionof the surfaces of the LEDs 14 or the circuit board 16, or both.

In an example, flame treatment includes exposing the portions of thecircuit board 16 to be surface treated to a flame for a short period oftime, which can activate the surfaces of the circuit board 16 to promotebonding the encapsulating material. The flame can also be used as amethod of delivering one or more compounds that can increase the surfaceenergy of the surfaces to be treated in order to provide for improvedadhesion between the surface being treated and the material of theencapsulating mask 20. The flame can be formed by combusting a mixtureof a fuel, such as natural gas, and air at a burner. The portions of thecircuit board 16 to be treated can be passed through the flame at theburner so that each portion to be flame treated is exposed to the flamefor long enough to activate the surfaces, but not so long so as todamage or otherwise alter the circuit board 16, the LEDs 14, or anyother electrical components on the circuit board 16. The flame treatmentcan alter the surface tension of the surfaces of the circuit board 16 orthe LEDs 14, or both, or can alter the surface energy of the surfaces.In an example, each portion of the circuit board 16 that is to be flametreated is exposed to the flame for a short period of time, e.g., only afew milliseconds to a half a second.

In an example, UVO treatment includes exposing the portions of thecircuit board 16 to be surface-treated to a source of ultravioletradiation for a specified period of time in the presence of oxygen gas(O₂). In an example, the source of ultraviolet radiation comprises anexcimer vacuum ultraviolet (VUV) light sources. In some examples, theUVO treatment removes unwanted material on the surfaces being treated,such as organic surface contaminants, e.g., hydrocarbons. In an example,the UVO treatment oxidizes the surface material. For example, oxidationof organic surface contaminants oxidizes the organic compounds of thecontaminants, e.g., hydrocarbons, to form CO₂ gas, water vapor (H₂O),and low-molecular weight compounds that can be more easily removed fromthe surface, e.g., volatile or gaseous organic or inorganic compounds.

Ultraviolet ionizing radiation, or UV ionizing radiation, can include aUV source of sufficient intensity to ionize a molecule, such as an O₂molecule, into constituent atoms, such as individual oxygen atoms (O.).In some examples, if the ultraviolet radiation has sufficient energy,molecules of the O₂ gas are split into single oxygen atoms (O.). Singleoxygen atoms are highly reactive, and will typically react with anotherO₂ molecule, resulting in the formation of an ozone molecule (O₃). Theozone molecules formed by this reaction will, in some examples, contactand react with contaminants on the surfaces being treated. In someexamples, a portion of the single oxygen atoms formed by splitting O₂molecules will also contact and react with the surface contaminants. Inan example, the reaction of one or both of single oxygen atoms (O.) orozone molecules (O₃) with the surface contaminants oxidizes thecontaminants, converting the contaminants to compounds that can moreeasily be removed. In some examples, the UVO treatment removes unwantedmaterial on the surfaces being treated, such as organic surfacecontaminants, e.g., hydrocarbons. In an example, the UVO treatmentoxidizes the surface material. For example, oxidation of organic surfacecontaminants oxidizes the organic compounds of the contaminants, e.g.,hydrocarbons, to form CO₂ gas, water vapor (H₂O), and low-molecularweight compounds that can be more easily removed from the surface, e.g.,volatile or gaseous organic or inorganic compounds.

In an example, the UVO treatment activates the surfaces to provide foradhesion of the material of the encapsulating mask 20 to the surfacebeing treated that is better than would be achieved without the UVOtreatment. In an example, the UVO treatment alters the surface tensionof a treated surface or modifies the surface energy of the treatedsurface, or both. The modified surface tension or surface energy, orboth, allows for better wetting of the material that forms theencapsulation mask 20, e.g., during molding, such as to provide forbetter bonding between the encapsulation mask 20 and the treatedsurface. In an example, the UVO treatment treats surfaces of one or moreof the LEDs 14, the circuit board 16, and electrical joints between theLEDs 14 and the circuit board 16, e.g., at solder 260 (FIG. 10).

As discussed above, in an example, wherein the encapsulating mask 20 isconfigured to encapsulate substantially the entire circuit board 16,e.g., the front face 18, the rear face 30, and the edge 32 of thecircuit board 16. In such a case, both the front face 18 and the rearface 30, and if desired the edge 32, can be surface treated, such as byapplying a chemical primer or other chemical treatment to the faces 18,30 and edge 32, or by plasma treating or flame treating the rear face 30and edge 32 in addition to the front face 18.

After surface treating the surfaces to be encapsulated (e.g., the frontface 18, and if desired, the rear face 30 and the edge 32), theencapsulating mask 20 can be formed over the circuit board 16. Theencapsulating mask 20 can be adhered to the circuit board 16 and theLEDs 14 such that the LEDs 14 and any other electronic componentsencapsulated by the encapsulating mask 20 are substantially sealed,e.g., are substantially sealed against moisture and air.

In an example, forming the encapsulating mask 20 can comprise casting ormolding the encapsulating material to form the encapsulating mask 20.Casting or molding the encapsulating mask 20 can comprise a number ofsteps. At 106, the circuit board 16 (which may or may not have beensurface treated, as described above with respect to step 104) can beplaced into a mold 34 (see, e.g., FIG. 7). The mold 34 can comprise acavity 36 having a geometry corresponding to the desired geometry of theencapsulating mask 20. For example, the cavity 36 can include aplurality of pockets 38 that correspond to the shape of the projections21 of the encapsulating mask 20. In an example, the circuit board 16 canbe placed into the mold 34 with the front face 18 facing down so thateach of the LEDs 14 can be placed into and positioned within acorresponding pocket 38. The mold 34 can also include one or morepositioning structures 40 that correspond to other geometric features ofthe circuit board 16 to ensure that the circuit board 16 is properlyaligned with the mold 34. A jig 42 can be mounted to the mold 34 to holdthe circuit board 16 in the proper position and alignment, for examplewhile the mold 34 is moved around.

At 108, the encapsulating material 44 of the encapsulating mask 20 canbe dispensed into the mold 34, as shown in FIG. 7. In an example, theencapsulating material 44 can be dispensed using a vacuum moldingtechnique. The encapsulating material 44 can comprise a gel-likematerial that comprises the material of the encapsulating mask 20. Insome examples, the encapsulating material 44 can comprise asilicone-based or a polyurethane-based gel that can be dispensed by anyacceptable gel or liquid dispensing technique.

The mold 34 can be placed into a vacuum chamber where a vacuum pressurecan be applied. In an example, the vacuum pressure in the vacuum chambercan be between about 10 torr (about 1.33 kilopascal) and about 40 torr(about 5.33 kilopascal). After the vacuum is formed in the vacuumchamber (e.g., after sufficient air has been evacuated from the vacuumchamber), the encapsulating material 44 can be dispensed into the mold34. The application of a vacuum to the encapsulating material 44 canprovide for the removal of air or other gas bubbles entrained within theencapsulating material 44. An air or gas bubble that is in front of anLED 14, e.g., within a projection 21, can distort the optics from theLED 14. Therefore, removal of air or gas bubbles from the encapsulatingmaterial 44 can, in some examples, be critical. In an example, theencapsulating material 44 can be “pre-vacuumed,” e.g., the encapsulatingmaterial 44 can be subjected to a vacuum before it is dispensed into themold 34 in order to remove a substantial portion of the air or other gasfrom within the encapsulating material 44. The encapsulating material 44can be dispensed into the mold 34 until the encapsulating material 44covers a desired portion of the circuit board 16. In an example, theencapsulating material 44 can be dispensed until it covers the entirerear face 30 or substantially the entire rear face 30. After dispensingthe encapsulating material 44, the mold 34 can be allowed to flow aroundthe circuit board 16 and to settle for a predetermined period of time.In an example, the encapsulating material 44 can be allowed to flow andsettle for from about 2 seconds to about 3 minutes, such as from about 3seconds to about 10 seconds. The mold 34 can then be removed from thevacuum chamber.

At 110, after dispensing the encapsulating material 44 into the mold 34,the encapsulating material 44 can be cured to form the substantiallysolidified encapsulating mask 20. In an example, the encapsulatingmaterial 44 can be a heat curable material that will cure upon theapplication of sufficient heat energy so that the encapsulating material44 reaches a trigger temperature. In an example, the mold 34 with thedispensed encapsulating material 44 can be heated to the triggertemperature encapsulating material 44 with a heater. In an example, themold 34 can be placed between a pair of heating plates. The mold 34 andthe jig 42 can be compressed between the heating plates. The heatingplates can then be heated to a temperature that is sufficient so thatheat transferred from the heating plates through the mold 34 and the jig42 will be sufficient for the encapsulating material 44 to reach thetrigger temperature. The heat from the heating plates will heat the mold34 and the jig 42, which can then heat the encapsulating material 44 viaconduction. The heated encapsulating material 44 can begin to cure andsolidify, eventually forming the encapsulating mask 20. In an example,the encapsulating material 44 can continue to cure and solidify afterthe mold 34 is removed from the heater. In an example, the curing of theencapsulating material 44 causes the encapsulating mask 20 to be adheredto the surfaces to be encapsulated. As described above, the surfacetreatment, such as chemical treatment or flame treatment, can facilitateadhesion of the encapsulating mask 20 to the circuit board 16.

At 112, after curing the encapsulating material 44 via heating, the mold34 can optionally be cooled, such as by a cooler. In an example, thecooler can comprise a pair of cooled plates that can be similar to theheating plates of the heater, with the mold 34 and the jig 42 beingcompressed between the cooling plates. A cooling fluid, such as chilledwater, can be circulated by or through the cooled plates. The cooler cancool the mold 34 and the cured encapsulating mask 20, such as down toroom temperature.

At 114, after curing the encapsulating material 44 to form theencapsulating mask 20 and, if desired, cooling the mold 34, theencapsulated circuit board 16 can be removed from the mold 34. In anexample, the encapsulated circuit board 16 can be removed by unsecuringthe jig 42 from the mold 34 and lifting the encapsulated circuit board16 from the mold 34. The used mold 34 and jig 42 can be returned to thesurface treatment step where a newly treated circuit board 16 can beplaced into the mold 34, secured by the jig 42, and the encapsulatingmaterial 44 dispensing process can be started again.

At 116, the video display module 10 can be assembled using theencapsulated circuit board 16. The encapsulated circuit board 16 can bealigned with a corresponding louver 24 and a corresponding housing 22.In an example, a frame (not shown) can be used to position the louver24, the encapsulated circuit board 16, and the housing 22 with respectto each other. In an example, the louver 24 is first placed on theframe, with a front side of the louver 24 being placed down on theframe. Next, the encapsulated circuit board 16 can be placed, with thefront face 18 down onto the louver 24. The circuit board 16 can comprisea plurality of louver registering openings that corresponding to aplurality of louver pegs 46 that extend rearward from the louver 24(best seen in FIG. 2). The louver pegs 46 can be aligned with the louverregistering openings in the circuit board 16 to align the louver 24 andthe encapsulated circuit board 16 with respect to each other. Next, thehousing 22 can be placed with a front side of the housing being placeddown onto the rear face 30 of the encapsulated circuit board 16.Aligning structures on the rear face 30 of the circuit board 16 and thefront side of the housing 22 can ensure alignment of the encapsulatedcircuit board 16 and the housing 22. Alternatively, the louverregistration openings in the circuit board 16 can extend throughout theentire thickness of the circuit board 16 so that the pegs 46 can extendthrough the circuit board 16 and past the rear face 30. The aligningstructures of the housing 22 can include a plurality of registrationrecesses that can each receive a portion of a corresponding louver pegs46 so that the louver 24, the encapsulated circuit board 16, and thehousing 22 can be aligned with respect to one another.

After aligning the louver 24, the encapsulated circuit board 16, and thehousing 22, the components can be attached together. In an example, thelouver 24 and the housing 22 can be made from a plastic or otherpolymeric material, so that the louver 24, encapsulated circuit board16, and housing 22 can be welded together. As noted above, the louverregistering openings in the circuit board 16 can extend through theentire thickness of the circuit board 16 so that the louver pegs 46 canextend through the circuit board 16 and contact the housing 22. Theregistration recesses of the housing 22 can receive the correspondinglouver pegs 46. The components can then be clamped together, and thelouver pegs 46 can be welded to the housing 22. In an example, aclamping apparatus can include a plurality of heating probes that arealigned with the louver pegs 46 and the registration recesses of thehousing 22. When the module components are clamped together, the heatingprobes can be compressed against the housing 22 or the louver 24 at thelocations of the louver pegs 46 and heat can be locally applied, whichcan heat stake the louver pegs 46 so that the louver pegs 46 becomecoupled with the housing 22. The louver pegs 46 can also become coupledwith the encapsulated circuit board 16, such as by becoming coupled tothe encapsulating mask 20. The module 10 can then be allowed to coolwhile still clamping the module components together so that the louverpegs 46 cool and become coupled to the housing 22 to form a moduleassembly.

After attaching the louver 24, the encapsulated circuit board 16, andthe housing 22 together, any final components of the video displayassembly 10 can be assembled, as needed. For example, electronics 48(FIG. 5), such as power supply electronics or control electronics, canbe coupled to the housing and electrically coupled to the electronics ofthe circuit board. A fan 50 can be coupled adjacent to the electronicsand the housing 22. The electronics 48 and the fan 50 can be attached tothe assembly, for example, by fastening the electronics 48 and the fan50 to the housing 22 with fasteners, such as screws 52.

To better illustrate the apparatuses and methods disclosed herein, anon-limiting list of examples is provided here:

EXAMPLE 1 can include subject matter (such as an apparatus, a device, amethod, or one or more means for performing acts), such as can include avideo display module comprising a circuit board having a front face, aplurality of light-emitting elements electrically coupled to the frontface of the circuit board, and a polymer encapsulating member adhered toat least the front face of the circuit board, the polymer encapsulatingmember substantially covering at least a portion of the circuit boardand a portion of the plurality of light-emitting elements, the polymerencapsulating member substantially sealing the portion of the circuitboard and the portion of the plurality of light-emitting elements.

EXAMPLE 2 can include, or can optionally be combined with the subjectmatter of EXAMPLE 1, to optionally include the polymer encapsulatingmember having a profile that substantially corresponds to a matingprofile of the portion of the circuit board and the portion of theplurality of light-emitting elements.

EXAMPLE 3 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1 and 2, to optionallyinclude the front face of the circuit board being treated to promoteadhesion between the polymer encapsulating member and the front face.

EXAMPLE 4 can include, or can optionally be combined with the subjectmatter of EXAMPLE 3, to optionally include the front face of the circuitboard being treated by plasma treating the front face.

EXAMPLE 5 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 3 and 4, to optionallyinclude the front face of the circuit board being treated by flametreating the front face.

EXAMPLE 6 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 3-5, to optionally includethe front face of the circuit board being treated by applying a primerto the front face.

EXAMPLE 7 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-6, to optionally includethe portion of the circuit board being treated to promote adhesionbetween the polymer encapsulating member and the portion of the circuitboard.

EXAMPLE 8 can include, or can optionally be combined with the subjectmatter of EXAMPLE 7, to optionally include at least the portion of thecircuit board being treated by plasma treating.

EXAMPLE 9 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 7 and 8, to optionallyinclude at least the portion of the circuit board being treated by flametreating.

EXAMPLE 10 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 7-9, to optionally includeat least the portion of the circuit board being treated by applying aprimer to the portion of the circuit.

EXAMPLE 11 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-10, to optionally includethe portion of the plurality of light-emitting elements being treated topromote adhesion between the polymer encapsulating member and theportion of the plurality of light-emitting elements.

EXAMPLE 12 can include, or can optionally be combined with the subjectmatter of EXAMPLE 11, to optionally include at least the portion of thelight-emitting elements being treated by plasma treating.

EXAMPLE 13 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 11 and 12, to optionallyinclude at least the portion of the light-emitting elements beingtreated by flame treating.

EXAMPLE 14 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 11-13, to optionallyinclude at least the portion of the light-emitting elements beingtreated by applying a primer to the portion of the light-emittingelements.

EXAMPLE 15 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-14, to optionally includethe plurality of light-emitting elements comprising surface-mountedlight-emitting elements.

EXAMPLE 16 can include, or can optionally be combined with the subjectmatter of EXAMPLE 15, to optionally include each of the plurality ofsurface-mounted light-emitting elements being soldered to the circuitboard with an ultraviolet light resistant solder.

EXAMPLE 17 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-16, to optionally includeat least a portion of the polymer encapsulating member over each of theportion of the plurality of light-emitting elements being substantiallytransparent to visible light.

EXAMPLE 18 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-17, to optionally includea louver mounted over the polymer encapsulating member.

EXAMPLE 19 can include, or can optionally be combined with the subjectmatter of EXAMPLE 18, to optionally include the louver comprising louverblades extending from an exterior side of the louver.

EXAMPLE 20 can include, or can optionally be combined with the subjectmatter of EXAMPLE 19, to optionally include the louver blades extendingat least partially over each of the plurality of light-emittingelements.

EXAMPLE 21 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 19 and 20, to optionallyinclude the louver blades extending at least partially under each of theplurality of light-emitting elements.

EXAMPLE 22 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 18-21, to optionallyinclude the louver comprising a plurality of openings.

EXAMPLE 23 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 1-22, to optionally include the polymerencapsulating member comprising a plurality of light-emitting elementreceiving projections that extend from an exterior side of the polymerencapsulating member.

EXAMPLE 24 can include, or can optionally be combined with the subjectmatter of EXAMPLE 23, to optionally include each projection beingconfigured to receive one of the plurality of light-emitting elements.

EXAMPLE 25 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 22 and 24, to optionallyinclude each light-emitting element receiving projection extending atleast partially into one of the plurality of openings in the louver.

EXAMPLE 26 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-25, to optionally includethe circuit board comprising a rear face opposing the front face.

EXAMPLE 27 can include, or can optionally be combined with the subjectmatter of EXAMPLE 26, to optionally include the polymer encapsulatingmember covering substantially all of the front face.

EXAMPLE 28 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 26 and 27, to optionallyinclude the polymer encapsulating member covering substantially all ofthe rear face.

EXAMPLE 29 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 26-28, to optionallyinclude the rear face of the circuit board being treated to promoteadhesion between the polymer encapsulating member and the rear face.

EXAMPLE 30 can include, or can optionally be combined with the subjectmatter of EXAMPLE 29, to optionally include the rear face of the circuitboard being treated by plasma treating the rear face.

EXAMPLE 31 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 29 and 30, to optionallyinclude the rear face of the circuit board being treated by flametreating the rear face.

EXAMPLE 32 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 29-31, to optionallyinclude the rear face of the circuit board being treated by applying aprimer to the rear face.

EXAMPLE 33 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-32, to optionally includethe circuit board comprising an edge along one or more sides extendingrearward from the front face.

EXAMPLE 34 can include, or can optionally be combined with the subjectmatter of EXAMPLE 33, to optionally include the polymer encapsulatingmember covering substantially all of the edge.

EXAMPLE 35 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 33 and 34, to optionallyinclude the edge of the circuit board being treated to promote adhesionbetween the polymer encapsulating member and the edge.

EXAMPLE 36 can include, or can optionally be combined with the subjectmatter of EXAMPLE 35, to optionally include the edge of the circuitboard being treated by plasma treating the edge.

EXAMPLE 37 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 35 and 36, to optionallyinclude the edge of the circuit board being treated by flame treatingthe edge.

EXAMPLE 38 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 35-37, to optionallyinclude the edge of the circuit board being treated by applying a primerto the edge.

EXAMPLE 39 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-38, to optionally includethe polymer encapsulating member comprising a silicone or polyurethanematerial.

EXAMPLE 40 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-39, to include subjectmatter (such as an apparatus, a device, a method, or one or more meansfor performing acts), such as can include a video display modulecomprising a circuit board having a front face, a plurality oflight-emitting elements electrically coupled to the front face of thecircuit board, and a polymer encapsulating member adhered to the frontface of the circuit board, the polymer encapsulating membersubstantially covering at least a portion of the circuit board and aportion of the plurality of light-emitting elements, wherein the polymerencapsulating member is shaped over each of the portion of the pluralityof light-emitting elements to form a lens over each of the portion ofthe plurality of light-emitting elements.

EXAMPLE 41 can include, or can optionally be combined with the subjectmatter of EXAMPLE 40, to optionally include the shape of each lens overeach of the portion of the plurality of light-emitting elements beingconfigured to provide for a predetermined viewing angle of each of theportion of the plurality of light-emitting elements.

EXAMPLE 42 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 40 and 41, to optionallyinclude the polymer encapsulating member substantially sealing theportion of the circuit board.

EXAMPLE 43 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 40-42, to optionallyinclude the polymer encapsulating member substantially sealing theportion of the plurality of light-emitting elements.

EXAMPLE 44 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 40-43, to optionallyinclude the front face of the circuit board being treated to promoteadhesion between the polymer encapsulating member and the front face.

EXAMPLE 45 can include, or can optionally be combined with the subjectmatter of EXAMPLE 44, to optionally include the front face of thecircuit board being treated by plasma treating the front face.

EXAMPLE 46 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 44 and 45, to optionallyinclude the front face of the circuit board being treated by flametreating the front face.

EXAMPLE 47 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 44-46, to optionallyinclude the front face of the circuit board being treated by applying aprimer to the front face.

EXAMPLE 48 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 40-47, to optionallyinclude the portion of the circuit board being treated to promoteadhesion between the polymer encapsulating member and the portion of thecircuit board.

EXAMPLE 49 can include, or can optionally be combined with the subjectmatter of EXAMPLE 48, to optionally include at least the portion of thecircuit board being treated by plasma treating.

EXAMPLE 50 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 48 and 49, to optionallyinclude at least the portion of the circuit board being treated by flametreating.

EXAMPLE 51 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 48-50, to optionallyinclude at least the portion of the circuit board being treated byapplying a primer to the portion of the circuit.

EXAMPLE 52 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 40-51, to optionallyinclude the portion of the plurality of light-emitting elements beingtreated to promote adhesion between the polymer encapsulating member andthe portion of the plurality of light-emitting elements.

EXAMPLE 53 can include, or can optionally be combined with the subjectmatter of EXAMPLE 52, to optionally include at least the portion of thelight-emitting elements being treated by plasma treating.

EXAMPLE 54 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 52 and 53, to optionallyinclude at least the portion of the light-emitting elements beingtreated by flame treating.

EXAMPLE 55 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 52-54, to optionallyinclude at least the portion of the light-emitting elements beingtreated by applying a primer to the portion of the light-emittingelements.

EXAMPLE 56 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 40-55, to optionallyinclude the plurality of light-emitting elements comprisingsurface-mounted light-emitting elements.

EXAMPLE 57 can include, or can optionally be combined with the subjectmatter of EXAMPLE 56, to optionally include each of the plurality ofsurface-mounted light-emitting elements are soldered to the circuitboard with an ultraviolet light resistant solder.

EXAMPLE 58 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 40-57, to optionallyinclude a louver mounted over the polymer encapsulating member.

EXAMPLE 59 can include, or can optionally be combined with the subjectmatter of EXAMPLE 58, to optionally include the louver comprising louverblades extending from an exterior side of the louver.

EXAMPLE 60 can include, or can optionally be combined with the subjectmatter of EXAMPLE 59, to optionally include the louver blades extendingat least partially over each of the plurality of light-emittingelements.

EXAMPLE 61 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 59 and 60, to optionallyinclude the louver blades extending at least partially under each of theplurality of light-emitting elements.

EXAMPLE 62 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 58-61, to optionallyinclude the louver comprising a plurality of openings.

EXAMPLE 63 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 40-63, to optionally include the polymerencapsulating member comprising a plurality of light-emitting elementreceiving projections that extend from an exterior side of the polymerencapsulating member.

EXAMPLE 64 can include, or can optionally be combined with the subjectmatter of EXAMPLE 63, to optionally include each projection beingconfigured to receive one of the plurality of light-emitting elements.

EXAMPLE 65 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 62 and 64, to optionallyinclude each light-emitting element receiving projection extending atleast partially into one of the plurality of openings in the louver.

EXAMPLE 66 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 40-65, to optionally include the circuitboard comprising a rear face opposing the front face.

EXAMPLE 67 can include, or can optionally be combined with the subjectmatter of EXAMPLE 66, to optionally include the polymer encapsulatingmember covering substantially all of the front face.

EXAMPLE 68 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 66 and 67, to optionallyinclude the polymer encapsulating member covering substantially all ofthe rear face.

EXAMPLE 69 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 66-68, to optionallyinclude the rear face of the circuit board being treated to promoteadhesion between the polymer encapsulating member and the rear face.

EXAMPLE 70 can include, or can optionally be combined with the subjectmatter of EXAMPLE 69, to optionally include the rear face of the circuitboard being treated by plasma treating the rear face.

EXAMPLE 71 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 69 and 70, to optionallyinclude the rear face of the circuit board being treated by flametreating the rear face.

EXAMPLE 72 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 69-71, to optionallyinclude the rear face of the circuit board being treated by applying aprimer to the rear face.

EXAMPLE 73 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 40-72, to optionallyinclude the circuit board comprising an edge along one or more sidesextending from the front face.

EXAMPLE 74 can include, or can optionally be combined with the subjectmatter of EXAMPLE 73, to optionally include the polymer encapsulatingmember covering substantially all of the edge.

EXAMPLE 75 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 73 and 74, to optionallyinclude the edge of the circuit board being treated to promote adhesionbetween the polymer encapsulating member and the edge.

EXAMPLE 76 can include, or can optionally be combined with the subjectmatter of EXAMPLE 75, to optionally include the edge of the circuitboard being treated by plasma treating the edge.

EXAMPLE 77 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 75 and 76, to optionallyinclude the edge of the circuit board being treated by flame treatingthe edge.

EXAMPLE 78 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 75-77, to optionallyinclude the edge of the circuit board being treated by applying a primerto the edge.

EXAMPLE 79 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 40-78, to optionally include the polymerencapsulating member comprising a silicone material.

EXAMPLE 80 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 40-79, to optionally include the polymerencapsulating member comprising a polyurethane material.

EXAMPLE 81 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 1-80, to include subjectmatter (such as an apparatus, a device, a method, or one or more meansfor performing acts), such as can include a method of manufacturing avideo display module, the method comprising providing or receiving acircuit board comprising a plurality of light-emitting elements mountedto a front face of the circuit board, forming a polymer encapsulatingmember over at least a portion of the front face of the circuit boardand at least a portion of the plurality of light-emitting elements,adhering the polymer encapsulating member to the front face of thecircuit board, and sealing at least the portion of the front face of thecircuit board and the portion of the plurality of light-emittingelements with the polymer encapsulating member.

EXAMPLE 82 can include, or can optionally be combined with the subjectmatter of EXAMPLE 81, to optionally include the providing the circuitboard comprising mounting the plurality of light-emitting elements tothe front face of the circuit board.

EXAMPLE 83 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 81 and 82, to optionally include formingthe polymer encapsulating member with a profile that substantiallycorresponds to a mating profile of the portion of the front face of thecircuit board and the portion of the plurality of light-emittingelements.

EXAMPLE 84 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 81-83, to optionally include molding apolymer material to form the polymer encapsulation member.

EXAMPLE 85 can include, or can optionally be combined with the subjectmatter of EXAMPLE 84, to optionally include molding the polymer materialover at least the portion of the front face of the circuit board.

EXAMPLE 86 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 84 and 85, to optionally include moldingthe polymer material over at least the portion of the plurality oflight-emitting elements.

EXAMPLE 87 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLE 81-86, to optionally include casting apolymer material to form the polymer encapsulation member.

EXAMPLE 88 can include, or can optionally be combined with the subjectmatter of EXAMPLE 87, to optionally include casting the polymer materialover at least the portion of the front face of the circuit board.

EXAMPLE 89 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 87 and 88, to optionally include castingthe polymer material over at least the portion of the plurality oflight-emitting elements.

EXAMPLE 90 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 84-89, to optionally include the polymermaterial comprising a polyurethane.

EXAMPLE 91 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLEs 84-90, to optionally include the polymermaterial comprising a silicone.

EXAMPLE 92 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 81-91, to optionally include treating atleast the portion of the front face of the circuit board to promoteadhesion between the polymer encapsulating member and the portion of thefront face of the circuit board.

EXAMPLE 93 can include, or can optionally be combined with the subjectmatter of EXAMPLE 92, to optionally include the treating comprisingplasma treating at least the portion of the front face of the circuitboard.

EXAMPLE 94 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 92 and 93, to optionally include thetreating comprising flame treating at least the portion of the frontface of the circuit board.

EXAMPLE 95 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 92-94, to optionally include the treatingcomprising applying a primer to at least the portion of the front faceof the circuit board.

EXAMPLE 96 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 81-95, to optionally include treating atleast the portion of the plurality of light-emitting elements to promoteadhesion between the polymer encapsulating member and the portion of theplurality of light-emitting elements.

EXAMPLE 97 can include, or can optionally be combined with the subjectmatter of EXAMPLE 96, to optionally include the treating comprisingplasma treating at least the portion of the plurality of light-emittingelements.

EXAMPLE 98 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 96 and 97, to optionally include thetreating comprising flame treating at least the portion of the pluralityof light-emitting elements.

EXAMPLE 99 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 96-98, to optionally include the treatingcomprising applying a primer to at least the portion of the plurality oflight-emitting elements.

EXAMPLE 100 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 81-99, to optionally include the circuitboard comprising a rear face opposing the front face.

EXAMPLE 101 can include, or can optionally be combined with the subjectmatter of EXAMPLE 100, to optionally include forming the polymerencapsulating member to cover substantially all of the front face.

EXAMPLE 102 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 100 and 101, to optionallyinclude forming the polymer encapsulating member to cover substantiallyall of the rear face.

EXAMPLE 103 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 100-102, to optionallyinclude treating at least the rear face of the circuit board to promoteadhesion between the polymer encapsulating member and the rear face.

EXAMPLE 104 can include, or can optionally be combined with the subjectmatter of EXAMPLE 103, to optionally include the treating comprisingplasma treating at least the rear face of the circuit board.

EXAMPLE 105 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 103 and 104, to optionallyinclude the treating comprising flame treating at least the rear face ofthe circuit board.

EXAMPLE 106 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 103-105, to optionallyinclude the treating comprising applying a primer to at least the rearface of the circuit board.

EXAMPLE 107 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 40-72, to optionallyinclude the circuit board comprising an edge along one or more sidesextending from the front face.

EXAMPLE 108 can include, or can optionally be combined with the subjectmatter of EXAMPLE 107, to optionally include forming the polymerencapsulating member to cover substantially all of the edge.

EXAMPLE 109 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 107 and 108, to optionallyinclude treating at least the edge of the circuit board to promoteadhesion between the polymer encapsulating member and the edge.

EXAMPLE 110 can include, or can optionally be combined with the subjectmatter of EXAMPLE 109, to optionally include the treating comprisingplasma treating at least the edge of the circuit board.

EXAMPLE 111 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 109 and 110, to optionallyinclude the treating comprising flame treating at least the edge of thecircuit board.

EXAMPLE 112 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 109-111, to optionallyinclude the treating comprising applying a primer to at least the edgeof the circuit board.

EXAMPLE 113 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 81-112, to optionally include the polymerencapsulating member comprising a silicone material.

EXAMPLE 114 can include, or can optionally be combined with the subjectmatter of any one of EXAMPLES 81-113, to optionally include the polymerencapsulating member comprising a polyurethane material.

EXAMPLE 115 can include subject matter (such as an apparatus, a device,a method, or one or more means for performing acts), such as can includea display module comprising a circuit board having a front face, aplurality of light-emitting elements electrically coupled to the frontface of the circuit board, a polymer encapsulating member adhered to atleast the front face of the circuit board, the polymer encapsulatingmember substantially covering at least a portion of the circuit boardand a portion of the plurality of light-emitting elements, the polymerencapsulating member substantially sealing the portion of the circuitboard and the portion of the plurality of light-emitting elements, andan ultraviolet-radiation diminishing component in the polymerencapsulating member or on one or more of the circuit board or at leasta portion of each of the light-emitting elements, wherein theultraviolet-radiation diminishing component filters, blocks, or reflectsmore ultraviolet radiation than would be filtered, blocked, or reflectedby the polymer encapsulating member without the ultraviolet-radiationdiminishing component.

EXAMPLE 116 can include, or can optionally be combined with the subjectmatter of Example 115, to optionally include the polymer encapsulatingmember having the base material and the ultraviolet-radiationdiminishing component include an additive added to the base materialthat causes the encapsulating member to filter, block, or reflect moreultraviolet radiation than would be filtered, blocked, or reflected bythe base material alone.

EXAMPLE 117 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115 and 116, to optionallyinclude the base material where the base material comprises at least oneof a silicone, a polyurethane, a nylon, and a polycarbonate.

EXAMPLE 118 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-117, to optionallyinclude the base material wherein the base material comprisespolydimethylsiloxane and the additive comprises at least one ofbenzophenone, benzotriazole, or octylmethoxy cinnamate, or the basematerial comprises nylon and the additive comprises an oxanilide, or thebase material comprises polycarbonate and the additive comprises abenzotriazole.

EXAMPLE 119 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-118, to optionallyinclude the ultraviolet-radiation diminishing component includes anultraviolet-radiation filtering or ultraviolet-radiation blockingcoating applied to one or more of the front face of the circuit board orat least a portion of each of the plurality of light-emitting elements,wherein the ultraviolet-radiation filtering or ultraviolet-radiationblocking coating comprises carbon black and a carbon black pigment.

EXAMPLE 120 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-119, to optionallyinclude the polymer encapsulating member that has a profile thatsubstantially corresponds to a mating profile of the portion of thecircuit board and the portion of the plurality of light-emittingelements.

EXAMPLE 121 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-120, wherein theportion of the circuit board and the portion of the plurality oflight-emitting elements is treated to promote adhesion between thepolymer encapsulating member and the portion of the circuit board andthe portion of the plurality of light-emitting elements.

EXAMPLE 122 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-121, wherein at leastthe portion of the circuit board and the portion of the plurality oflight-emitting elements is treated by at least one of plasma treatingthe portion of the circuit board and the portion of the plurality oflight-emitting elements; flame treating the portion of the circuit boardand the portion of the plurality of light-emitting elements; exposingthe portion of the circuit board and the portion of the plurality oflight-emitting elements to an ultraviolet ionizing radiation in thepresence of oxygen gas; or applying a primer to the portion of thecircuit board and the portion of the plurality of light-emittingelements.

EXAMPLE 123 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-122, wherein theplurality of light-emitting elements comprises surface-mountedlight-emitting elements that are soldered to the circuit board withsolder.

EXAMPLE 124 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-123, wherein at least aportion of the polymer encapsulating member over each of the portion ofthe plurality of light-emitting elements is substantially transparent tovisible light.

EXAMPLE 125 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-124, optionallyincluding a louver mounted over the polymer encapsulating member, thelouver comprising a plurality of openings, wherein the polymerencapsulating member comprises a plurality of light-emitting elementreceiving projections that extend from an exterior side of the polymerencapsulating member, each projection being configured to receive one ofthe plurality of light-emitting elements, wherein each light-emittingelement receiving projection extends at least partially into one of theplurality of openings in the louver.

EXAMPLE 126 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-125, wherein thecircuit board comprises a rear face opposing the front face and an edgealong one or more sides extending rearward from the front face towardthe rear face, wherein the polymer encapsulating member is adhered tosubstantially all of the front face, substantially all of the edge, andat least a portion of the rear face.

EXAMPLE 127 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-126, wherein the frontface, the edge, and the rear face of the circuit board are treated topromote adhesion between the polymer encapsulating member and the frontface and the rear face.

EXAMPLE 128 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-127, wherein the frontface, the edge, and the rear face of the circuit board are treated by atleast one of plasma treating, flame treating, exposure to an ultravioletionizing radiation source in the presence of oxygen gas, and applying aprimer thereto.

EXAMPLE 129 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 115-128, wherein thepolymer encapsulating member comprises a silicone or polyurethanematerial.

EXAMPLE 130 can include subject matter (such as an apparatus, a device,a method, or one or more means for performing acts), such as can includea display module comprising a circuit board having a front face, aplurality of light-emitting elements electrically coupled to the frontface of the circuit board, one or more electronic componentselectrically coupled to the front face of the circuit board, and apolymer encapsulating member adhered to the front face of the circuitboard, the polymer encapsulating member substantially covering at leasta portion of the circuit board, at least a portion of the one or moreelectronic components, and at least a portion of the plurality oflight-emitting elements wherein the polymer encapsulating memberfilters, blocks, or reflects sufficient ultraviolet radiation so thatthe circuit board, the electronic components, and the light-emittingelements will have a lifetime of at least seven years of outdoorexposure.

EXAMPLE 131 can include, or can optionally be combined with the subjectmatter of EXAMPLE 130, wherein the shape of each lens over each of theportion of the plurality of light-emitting elements is configured toprovide for a predetermined viewing angle of each of the portion of theplurality of light-emitting elements.

EXAMPLE 132 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130 and EXAMPLE 131, whereinthe polymer encapsulating member substantially seals the portion of thecircuit board and the portion of the plurality of light-emittingelements.

EXAMPLE 133 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLES 130-132, wherein thepolymer encapsulating member comprises a mixture of a base material andan additive, wherein the additive causes the encapsulating member tofilter, block, or reflect more ultraviolet radiation than would befiltered, blocked, or reflected by the base material alone.

EXAMPLE 134 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130-133, wherein the basematerial comprises at least one of: a silicone, a urethane, a nylon, ora polycarbonate.

EXAMPLE 135 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130-134, to optionallyinclude the base material wherein the base material comprisespolydimethylsiloxane and the additive comprises at least one ofbenzophenone, benzotriazole, or octylmethoxy cinnamate, or the basematerial comprises nylon and the additive comprises an oxanilide, or thebase material comprises polycarbonate and the additive comprises abenzotriazole.

EXAMPLE 136 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130-135, wherein at leastthe portion of the circuit board, the portion of the one or moreelectronic components, and the portion of the plurality oflight-emitting elements are treated to promote adhesion between thepolymer encapsulating member and the portion of the circuit board, theportion of the one or more electronic components, and the portion of theplurality of light-emitting elements.

EXAMPLE 137 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130-136, wherein at leastthe portion of the circuit board and the portion of the plurality oflight-emitting elements is treated by at least one of: plasma treating,flame treating, exposure to an ultraviolet ionizing radiation in thepresence of oxygen gas, or applying a primer thereto.

EXAMPLE 138 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130-137, wherein the circuitboard comprises a rear face opposing the front face and an edge alongone or more sides extending rearward from the front face toward the rearface, wherein the polymer encapsulating member is adhered tosubstantially all of the front face, substantially all of the edge, andat least a portion of the rear face.

EXAMPLE 139 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130-138, wherein the portionof the circuit board and the portion of the plurality of light-emittingelements, front face, the edge, and the rear face of the circuit boardare treated to promote bonding adhesion between the polymerencapsulating member and the portion of the circuit board and theportion of the plurality of light-emitting elements front face and therear face.

EXAMPLE 140 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130-139, wherein the portionof the circuit board and the portion of the plurality of light-emittingelements, front face, the edge, and the rear face of the circuit boardare treated by at least one of plasma treating, flame treating, UVOtreating, exposing the portion of the circuit board and the portion ofthe plurality of light-emitting elements to an ultraviolet ionizingradiation source in the presence of oxygen gas, and applying a primerthereto.

EXAMPLE 141 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130-140, to optionallyinclude solder electrically connecting the circuit board to at least oneof: the one or more electrical components, or the plurality oflight-emitting elements, wherein the polymer encapsulating memberfilters, blocks, or reflects sufficient ultraviolet radiation so thatthe solder will have a lifetime of at least seven years of outdoorexposure.

EXAMPLE 142 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 130-141, wherein the polymerencapsulating member comprises a silicone or polyurethane material.

EXAMPLE 143 can include subject matter (such as an apparatus, a device,a method, or one or more means for performing acts), such as can includea method of manufacturing a display module, comprising providing orreceiving a circuit board comprising a plurality of light-emittingelements mounted to a face of the circuit board, implementing a UVfilter including at least one of combining an additive with a polymerencapsulating member and applying a blocking coating to the circuitboard, forming a polymer encapsulating member over at least a portion ofthe face of the circuit board and at least a portion of the plurality oflight-emitting elements, adhering the polymer encapsulating member tothe face of the circuit board, and sealing at least the portion of theface of the circuit board and the portion of the plurality oflight-emitting elements with the polymer encapsulating member.

EXAMPLE 144 can include, or can optionally be combined with the subjectmatter of EXAMPLE 143, further comprising forming the polymerencapsulating member with a profile that substantially corresponds to amating profile of the portion of the face of the circuit board and theportion of the plurality of light-emitting elements.

EXAMPLE 145 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 143 and 144, wherein formingthe polymer encapsulation member comprises molding or casting a polymermaterial comprising at least one of polyurethane or silicone over atleast the portion of the face of the circuit board and the portion ofthe plurality of light-emitting elements.

EXAMPLE 146 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 143-145, further comprisingtreating at least one of the portion of the face of the circuit boardand the portion of the plurality of light-emitting elements to promotechemical bonding between the polymer encapsulating member and theportion of the face of the circuit board or the portion of the pluralityof light-emitting elements.

EXAMPLE 147 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 143-146, wherein thetreating comprises at least one of plasma treating, flame treating, UVOtreating, or applying a primer thereto.

EXAMPLE 148 can include subject matter (such as an apparatus, a device,a method, or one or more means for performing acts), such as can includea display module comprising a circuit board having a front face, aplurality of light-emitting elements electrically coupled to the frontface of the circuit board, one or more electronic componentselectrically coupled to the front face of the circuit board, anultraviolet-radiation filtering or blocking coating applied over atleast a portion of the circuit board and at least a portion of the oneor more electronic components; and a polymer encapsulating memberadhered to the front face of the circuit board, the polymerencapsulating member substantially covering at least a portion of thecircuit board, at least a portion of the one or more electroniccomponents, at least a portion of the ultraviolet-radiation filtering orblocking coating, and at least a portion of the plurality oflight-emitting elements.

EXAMPLE 149 can include, or can optionally be combined with the subjectmatter of EXAMPLE 148, wherein the ultraviolet-radiation filtering orblocking coating allows the circuit board and the one or more electroniccomponents to have a lifetime of at least seven years of outdoorexposure.

EXAMPLE 150 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 148 and 149, to optionallyinclude solder electrically coupling the circuit board to at least oneof the one or more electronic components or the plurality oflight-emitting elements, wherein the ultraviolet-radiation filtering orblocking coating is also applied over at least a portion of the solder.

EXAMPLE 151 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 148-150, wherein at leastthe portion of the circuit board, the portion of the one or moreelectronic components, the portion of the ultraviolet-radiationfiltering or blocking coating, and the portion of the plurality oflight-emitting elements are treated by at least one of plasma treating,flame treating, exposure to an ultraviolet ionizing radiation in thepresence of oxygen gas; or applying a primer thereto

EXAMPLE 152 can include, or can optionally be combined with the subjectmatter of one or any combination of EXAMPLE 148-151, wherein the circuitboard comprises a rear face opposing the front face and an edge alongone or more sides extending rearward from the front face toward the rearface, wherein the polymer encapsulating member is adhered tosubstantially all of the front face, substantially all of the edge, andat least a portion of the rear face.

The above Detailed Description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreelements thereof) can be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. Also, various features or elementscan be grouped together to streamline the disclosure. This should not beinterpreted as intending that an unclaimed disclosed feature isessential to any claim. Rather, inventive subject matter can lie in lessthan all features of a particular disclosed embodiment. Thus, thefollowing claims are hereby incorporated into the Detailed Description,with each claim standing on its own as a separate embodiment. The scopeof the invention should be determined with reference to the appendedclaims, along with the full scope of equivalents to which such claimsare entitled.

In the event of inconsistent usages between this document and anydocuments so incorporated by reference, the usage in this documentcontrols.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

Method examples described herein can be machine or computer-implemented,at least in part. Some examples can include a computer-readable mediumor machine-readable medium encoded with instructions operable toconfigure an electronic device to perform methods or method steps asdescribed in the above examples. An implementation of such methods ormethod steps can include code, such as microcode, assembly languagecode, a higher-level language code, or the like. Such code can includecomputer readable instructions for performing various methods. The codemay form portions of computer program products. Further, in an example,the code can be tangibly stored on one or more volatile, non-transitory,or non-volatile tangible computer-readable media, such as duringexecution or at other times. Examples of these tangiblecomputer-readable media can include, but are not limited to, hard disks,removable magnetic disks, removable optical disks (e.g., compact disksand digital video disks), magnetic cassettes, memory cards or sticks,random access memories (RAMs), read only memories (ROMs), and the like.

The Abstract is provided to comply with 37 C.F.R. § 1.72(b), to allowthe reader to quickly ascertain the nature of the technical disclosure.It is submitted with the understanding that it will not be used tointerpret or limit the scope or meaning of the claims.

1. A display module comprising: a circuit board having a front face anda plurality of electrical connection pads at the front face; a pluralityof light-emitting elements each electrically mounted to one or more ofthe plurality of electrical connection pads; and a polymer encapsulatingmember adhered to at least the front face of the circuit board, thepolymer encapsulating member substantially covering at least a portionof the circuit board, at least a portion of the plurality of electricalconnection pads, and a portion of the plurality of light-emittingelements, the polymer encapsulating member substantially sealing theportion of the circuit board, the portion of the plurality of electricalconnection pads, and the portion of the plurality of light-emittingelements.
 2. The display module of claim 1, wherein one or more of theportion of the circuit board, the portion of the plurality of electricalconnection pads, and the portion of the plurality of light-emittingelements is treated to promote adhesion between the polymerencapsulating member and the portion of the circuit board and theportion of the plurality of light-emitting elements.
 3. The displaymodule of claim 2, wherein one or more of the portion of the circuitboard, the portion of the plurality of electrical connection pads, andthe portion of the plurality of light-emitting elements is treated by atleast one of plasma treating one or more of the portion of the circuitboard, the portion of the plurality of electrical connection pads, andthe portion of the plurality of light-emitting elements; flame treatingone or more of the portion of the circuit board, the portion of theplurality of electrical connection pads, and the portion of theplurality of light-emitting elements; and applying a primer to one ormore of the portion of the circuit board, the portion of the pluralityof electrical connection pads, and the portion of the plurality oflight-emitting elements.
 4. The display module of claim 1, wherein atleast a portion of the polymer encapsulating member covering each of theportion of the plurality of light-emitting elements is substantiallytransparent to visible light.
 5. The display module of claim 1, furthercomprising a louver mounted over the polymer encapsulating member, thelouver comprising a plurality of openings, wherein the polymerencapsulating member comprises a plurality of light-emitting elementreceiving projections that extend from an exterior side of the polymerencapsulating member, each projection being configured to receive one ormore of the plurality of light-emitting elements, wherein eachlight-emitting element receiving projection extends at least partiallyinto one of the plurality of openings in the louver.
 6. The displaymodule of claim 1, wherein the circuit board comprises a rear faceopposing the front face and an edge along one or more sides extendingrearward from the front face toward the rear face, wherein the polymerencapsulating member is adhered to substantially all of the front face,substantially all of the edge, and substantially all of the rear face.7. The display module of claim 6, wherein the front face, the edge, andthe rear face of the circuit board are treated to promote adhesionbetween the polymer encapsulating member and the front face and the rearface.
 8. The display module of claim 7, wherein the front face, theedge, and the rear face of the circuit board are treated by at least oneof plasma treating, flame treating, and applying a primer.
 9. Thedisplay module of claim 1, wherein the polymer encapsulating membercomprises a silicone or polyurethane material.
 10. The display module ofclaim 1, wherein each of the plurality of light-emitting elements aremounted directly to the one or more of the plurality electricalconnection pads.
 11. A method of manufacturing a display module, themethod comprising: providing or receiving a circuit board comprising aplurality of light-emitting elements each electrically mounted to one ormore electrical connection pads on a front face of the circuit board;forming a polymer encapsulating member over at least a portion of thefront face of the circuit board, at least a portion of the electricalconnection pads, and at least a portion of the plurality oflight-emitting elements; adhering the polymer encapsulating member tothe front face of the circuit board; and sealing at least the portion ofthe front face of the circuit board, the portion of the electricalconnection pads, and the portion of the plurality of light-emittingelements with the polymer encapsulating member.
 12. The method of claim11, wherein forming the polymer encapsulation member comprises moldingor casting a polymer material over at least the portion of the face ofthe circuit board and the portion of the plurality of light-emittingelements.
 13. The method of claim 11, wherein the polymer materialcomprises at least one of polyurethane or silicone.
 14. The method ofclaim 11, further comprising treating at least one of the portion of thefront face of the circuit board, the portion of the electricalconnection pads, and the portion of the plurality of light-emittingelements to promote adhesion between the polymer encapsulating memberand the portion of the front face of the circuit board, the portion ofthe electrical connection pads, or the portion of the plurality oflight-emitting elements.
 15. The method of claim 14, wherein thetreating comprises at least one of plasma treating, flame treating, orapplying a primer.
 16. The method of claim 11, wherein the circuit boardcomprises a rear face opposing the front face and an edge along one ormore sides extending rearward from the front face toward the rear face;wherein forming the polymer encapsulating member includes forming thepolymer encapsulating member over at least a portion of the rear faceand at least a portion of the edge of the circuit board; and the methodfurther comprises adhering the polymer encapsulating member to one orboth of the rear face and the edge of the circuit board.
 17. The methodof claim 16, wherein forming the polymer encapsulating member includesforming the polymer encapsulating member over all or substantially allof the front face of the circuit board, all or substantially all of theplurality of light-emitting elements, all or substantially all of therear face of the circuit board, and all or substantially all of the edgeof the circuit board.
 18. The method of claim 16, further comprisingtreating at least one of the portion of the rear face of the circuitboard and the portion of the edge of the circuit board to promote theadhering between the polymer encapsulating member and the portion of therear face or the portion of the edge.
 19. The method of claim 18,wherein the treating comprises at least one of plasma treating, flametreating, or applying a primer.
 20. The method of claim 11, furthercomprising directly mounting each of the plurality of light-emittingelements to the one or more of the electrical connection pads.